TechConnect World 2010: A visual approach on MEMS process modelling using device cross-sections Print E-mail

Abstract

With MEMS entering fast moving consumer markets the need for more efficient design concepts becomes apparent. Without a common technology platform in sight, the only feasible solution seems to be extensive modularization and re-use of existing manufacturing technology. In this paper we propose a visual approach on process modelling by presenting a software tool that supports the device engineer in specifying a set of device cross-sections that satisfy the speci c requirements of thin lm manufacturing processes. The drawing tools are modeled to represent typical e ects of thin- lm semiconductor fabrication techniques. Geometrical analysis algorithms ensure adherence to manufacturing constraints. The tool is currently under evaluation within the European project CORONA (CP-FP 213969-2).

The full paper can be downloaded here.

 
Dr. Dirk Ortloff
Emil-Figge-Str. 76 - 80
44227 Dortmund
Germany
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Every new product or product enhancement starts with a new idea. In the area of process and device design for high-tech products like MEMS, NEMS, PV-Cells and Nanomaterials, personal experiences gained through previous developments provide a major contribution to new developments.

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